Tag: اتوماسیون سوپرب

8-layer 2-step HDI · 6.52 × 5.21 mm · 0.75 ± 0.08 mm · ENIG · Resin plug · Stacked laser via · White solder mask · 75 μm solder bridge · SMT assembly · Build-to-print from Gerber

Heavy copper PCB manufacturing — 16 layers · 5 oz inner copper · 3.75 mm · Press-fit ±0.05 mm · Resin plug · Blind via · Build-to-print from Gerber files

Bluetooth Module Carrier Board — RO4350B, 4L 1-Step HDI4-layer 1-step HDI · Rogers RO4350B · 0.55 mm · 14 × 21 mm · ENEPIG · Bluetooth 2.4 GHz ISM · Build-to-print from GerberProduct SpecificationsParameterValueProduct typeBluetooth module carrier bo

Rigid-flex PCB manufacturing — 14 layers · 10 rigid + 4 flex · 2+2 split · 2.2 mm · Panasonic · 3 mil line · Lead-free HASL · Build-to-print from Gerber files

Hybrid PCB manufacturing — PTFE+FR4 · 20 layers · 5.7 mm · 4-step blind via · Blind slot · Embedded resistors · Back drill · Build-to-print from Gerber files